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may 2006 rev 2 1/17 17 LIS2L02AL mems inertial sensor: 2-axis - +/-2g ultracompact linear accelerometer features 2.4v to 5.25v single supply operation low power consumption 2g full-scale 0.3mg resolution over 100hz bandwidth embedded self test output voltage, offset and sensitivity ratiometric to the supply voltage high shock survivability ecopack? lead-free compliant (see section 6 ) description the LIS2L02AL is a low-power 2-axis linear capacitive accelerometer that includes a sensing element and an ic interface able to take the information from the sensing element and to provide an analog signal to the external world. the sensing element, capable of detecting the acceleration, is manufactured using a dedicated process developed by st to produce inertial sensors and actuators in silicon. the ic interface is manufactured using a standard cmos process that allows high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics. the LIS2L02AL has a full scale of 2g and it is capable of measuring accelerations over a bandwidth of 2.0 khz for all axes. the device bandwidth may be reduced by using external capacitances. a self-tes t capability allows to check the mechanical and electrical signal path of the sensor. the LIS2L02AL is available in plastic smd package and it is guaranteed to operate over an extended temperature range of -40c to +85c. the LIS2L02AL belongs to a family of products suitable for a variety of applications: ? mobile terminals ? gaming and virtual reality input devices ? free-fall detection for data protection ? antitheft systems and inertial navigation ? appliance and robotics. order codes lga-8 part number temp range, cpackage packing LIS2L02AL -40c to +85c lga-8 tray LIS2L02ALtr -40c to +85c lga-8 tape & reel www.st.com obsolete product(s) - obsolete product(s)
contents LIS2L02AL 2/17 contents 1 block diagram & pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 ic interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.3 factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.2 output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 typical performance characteristi cs . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.1 mechanical characteristics at 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.2 mechanical characteristics derived from measurement in the -40c to +85c temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.3 electrical characteristics at 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 obsolete product(s) - obsolete product(s)
LIS2L02AL block diagram & pins description 3/17 1 block diagram & pins description 1.1 block diagram figure 1. block diagram 1.2 pin description figure 2. pin connection demux s/h charge amplifier s/h mux y+ y- voutx vouty routx routy trimming circuit clock x+ x- self test reference a direction of the detectable accelerations 1 LIS2L02AL st gnd voutx vouty reserved reserved vdd bottom view y x nc obsolete product(s) - obsolete product(s)
block diagram & pins description LIS2L02AL 4/17 table 1. pin description pin # pin name function 1 st self test (logic 0: normal mode; logic 1: self-test) 2 nc not connected 3 gnd 0v supply 4 reserved leave unconnected 5 reserved leave unconnected 6 vouty output voltage y channel 7 voutx output voltage x channel 8 vdd power supply obsolete product(s) - obsolete product(s)
LIS2L02AL mechanical and electrical specifications 5/17 2 mechanical and electrical specifications 2.1 mechanical characteristics table 2. mechanical characteristics (1) (temperature range -40c to +85c) all the parameters are specified @ vdd =3.3v, t = 25c unless otherwise noted symbol parameter test condition min. typ. (2) max. unit ar acceleration range (3) 1.8 2.0 g so sensitivity (4) full-scale = 2g vdd/5?10% vdd/5 vdd/5+10% v/g sodr sensitivity change vs temperature delta from +25c 0.01 %/c voff zero-g level (4) t = 25c vdd/2-6% vdd/2 vdd/2+6% v offdr zero-g level change vs temperature delta from +25c 0.2 mg/c nl non linearity (5) best fit straight line full-scale = 2g x, y axis 0.3 1.5 % crossax cross-axis (6) 2 4% an acceleration noise density vdd=3.3v; full-scale = 2g 30 g/ vt self test output voltage change (7),(8) t = 25c vdd=3.3v full-scale = 2g x axis -20 -50 -100 mv t = 25c vdd=3.3v full-scale = 2g y axis 20 50 100 mv fres sensing element resonance frequency (9) all axes 2.0 khz to p operating temperature range -40 +85 c wh product weight 0.08 gram 1. the product is factory calibrated at 3.3v . the device can be powered from 2.4v to 5.25v. voff, so and vt parameters will vary with supply voltage. 2. typical specificat ions are not guaranteed 3. guaranteed by wafer level test and measurement of initial offset and sensitivity 4. zero-g level and sensitivity are ess entially ratiometric to supply voltage 5. guaranteed by design 6. contribution to the measuring output of the inclination/acceleration along any perpendicular axis 7. self test ?output voltage change? is defined as vout (vst=logic1) -vout (vst=logic0) 8. self test ?output voltage change? va ries cubically with supply voltage 9. minimum resonance frequency fres =2.0khz. sensor bandwidth=1/(2* *110k ? *cload) with cload>1nf. hz obsolete product(s) - obsolete product(s)
mechanical and electrical specifications LIS2L02AL 6/17 2.2 electrical characteristics table 3. electrical characteristics (1) (temperature range -40c to +85c) all the parameters are specified @ vdd =3.3v, t=25c unless otherwise noted symbol parameter test condition min. typ. (2) max. unit vdd supply voltage 2.4 3.3 5.25 v idd supply current mean value 0.85 1.5 ma vst self test input logic 0 level 0 0.3*vdd v logic 1 level 0.7*vdd vdd v rout output impedance 80 110 140 k ? cload capacitive load drive (3) 1nf to p operating temperature range -40 +85 c 1. the product is factory calibrated at 3.3v 2. typical specificat ions are not guaranteed 3. minimum resonance frequency fres=2 .0khz. sensor bandwidth=1/(2* *110k ? *cload) with cload>1nf obsolete product(s) - obsolete product(s)
LIS2L02AL mechanical and electrical specifications 7/17 2.3 absolute maximum ratings stresses above those listed as ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. 2.4 terminology sensitivity describes the gain of the sensor and can be determined by applying 1g acceleration to it. as the sensor can measur e dc accelerations this can be done easily by pointing the axis of interest towards the center of the earth, note the output value, rotate the sensor by 180 degrees (point to the sky) and note the output value again thus applying 1g acceleration to the sensor. subtracting the larger output value from the smaller one and dividing the result by 2 will give the actual se nsitivity of the sensor. this value changes very little over temperature (see sensitivity change vs. temperature) and also very little over time. the sensitivity tolerance describes the range of sensitivities of a large population of sensors. zero-g level describes the actual output signal if there is no acceleration present. a sensor in a steady state on a horizontal surface will measure 0g in x axis and 0g in y axis. the output is ideally for a 3.3v powered sensor vdd/2 = 1650mv. a deviation from ideal 0-g level (1650mv in this case) is called zero-g offset. offset of prec ise mems sensors is to some extend a result of stress to the sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit boar d or exposing it to extensive mechanical stress. offset changes little over temperature - see ?zero-g level change vs. temperature? - the zero-g level of an individual sensor is ve ry stable over lifetime. the zero-g level tolerance describes the range of zero-g levels of a population of sensors. table 4. absolute maximum ratings symbol ratings maximum value unit vdd supply voltage -0.3 to 7 v vin input voltage on any control pin (st) -0.3 to vdd +0.3 v a pow acceleration (any axis, powered, vdd=3.3v) 3000g for 0.5 ms 10000g for 0.1 ms a unp acceleration (any axis, not powered) 3000g for 0.5 ms 10000g for 0.1 ms t stg storage temperature range -40 to +125 c esd electrostatic discharge protection 2kv hbm 200v mm 1500v cdm this is a mechanical shock sensitive device, improper handling can cause permanent damages to the part this is an esd sensitive device, improper handling can cause permanent damages to the part obsolete product(s) - obsolete product(s)
mechanical and electrical specifications LIS2L02AL 8/17 self test allows to test the mechanical and electric part of the sensor, allowing the seismic mass to be moved by means of an electrostatic test-force. the self test function is off when the st pin is connected to gnd. when the st pi n is tied at vdd an actuation force is applied to the sensor, simulating a definite input acce leration. in this case the sensor outputs will exhibit a voltage change in their dc levels wh ich is related to the selected full scale and depending on the supply voltage through the device sensitivity. when st is activated, the device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic test-force. if the output signals change within the amplitude specified inside table 2, than the sensor is working properly and the parameters of the interface chip are within the defined specification. output impedance describes the resistor inside the output stage of each channel. this resistor is part of a filter consisting of an external capacitor of at least 1nf and the internal resistor. due to the high resistor level only small, inexpensive external capacitors are needed to generate low corner frequencies. when interfacing with an adc it is important to use high input impedance input circuitries to avoid measurement errors. note that the minimum load capacitance forms a corner frequency beyond the resonance frequency of the sensor. for a flat frequency response a corner frequency well below the resonance frequency is recommended. in general the smallest possible bandwidth for an particular application should be chosen to get the best results. obsolete product(s) - obsolete product(s)
LIS2L02AL functionality 9/17 3 functionality the LIS2L02AL is a high performance, low-power, analog output 2-axis linear accelerometer packaged in a lga package. the complete device includes a sensing element and an ic interface able to take the information from the sensing element and to provide an analog signal to the external world. 3.1 sensing element a proprietary process is used to create a surface micro-machined accelerometer. the technology allows to carry out suspended s ilicon structures which are attached to the substrate in a few points called anchors and are free to move in the direction of the sensed acceleration. to be compatible with the traditional packaging techniques a cap is placed on top of the sensing element to avoid blocking the moving parts during the moulding phase of the plastic encapsulation. when an acceleration is applied to the sensor the proof mass displaces from its nominal position, causing an imbalance in the capacit ive half-bridge. this imbalance is measured using charge integration in response to a voltage pulse applied to the sense capacitor. at steady state the nominal value of the capacitors are few pf and when an acceleration is applied the maximum variation of the capacitive load is up to 100ff. 3.2 ic interface in order to increase robustness and immunity against external disturbances the complete signal processing chain uses a fully differenti al structure. the final stage converts the differential signal into a single-ended one to be compatible with the external world. the signals of the sensing element are multiplexed and fed into a low-noise capacitive charge amplifier that implements a correlated double sampling system (cds) at its output to cancel the offset and the 1/f noise. the output signal is de-multiplexed and transferred to two different s&hs, one for each channel and made available to the outside. the low noise input amplifier operates at 200 khz while the two s&hs operate at a sampling frequency of 66 khz. this allows a large oversampling ratio, which leads to in-band noise reduction and to an accurate output waveform. all the analog parameters (zero-g level, sensitivity and self-test) are ratiometric to the supply voltage. increasing or de creasing the supply voltage, th e sensitivity and the offset will increase or decrease almost linearly. the self test voltage change varies cubically with the supply voltage. 3.3 factory calibration the ic interface is factory calibrated for sensitivity (so) and zero-g level (voff). the trimming values are stored inside the device by a non volatile structure. any time the device is turned on, the trimming parameters are downloaded into the registers to be employed during the normal operation. this allows the user to employ the device without further calibration. obsolete product(s) - obsolete product(s)
application hints LIS2L02AL 10/17 4 application hints figure 3. LIS2L02AL electrical connection power supply decoupling capacitors (100nf ceramic or polyester + 10 f aluminum) should be placed as near as possible to the device (common design practice). the LIS2L02AL allows to band limit voutx and vouty through the use of external capacitors. the re-commended frequency range spans from dc up to 2.0khz. in particular, capacitors must be added at output pins to implement low-pass filtering for antialiasing and noise reduction. the equation for the cut-off frequency (f t ) of the external filters is: taking in account that the internal filtering resistor (r out ) has a nominal value equal to 110k ? , the equation for the external filter cut-off frequency may be simplified as follows: the tolerance of the internal resistor can vary typically of 20% within its nominal value of 110k ? ; thus the cut-off frequency will vary accord ingly. a minimum capacitance of 1nf for c load (x, y) is required in any case. . table 5. filter capacitor selection, c load (x,y) cut-off frequency capacitor value 1 hz 1500 nf 10 hz 150 nf 20 hz 68 nf 50 hz 30 nf 100 hz 15 nf 200 hz 6.8 nf 500 hz 3 nf vout x 100nf cload x LIS2L02AL 10f vdd vout y gnd gnd cload y (top view) optional optional digital signals direction of the detectable accelerations 1 y x gnd st f t 1 2 r out c load xy , () ?? ------------------------------------------------------------- - = f t 1.45 f c load xy , () ------------------------------ -hz [] = obsolete product(s) - obsolete product(s)
LIS2L02AL application hints 11/17 4.1 soldering information the lga-8 package is compliant with the ecopack,rohs and ?green? standard. it is qualified for soldering heat resistan ce according to jedec j-std-020c. pin 1 indicator is electrically connected to st pin. leave pin 1 indicator unconnected during soldering. land pattern and soldering recommendations are available upon request. 4.2 output response vs. orientation figure 4. output response vs. orientation figure 4 shows LIS2L02AL output response vs orientation at vdd=3.3v top view x=1.65v(0g) y=0.99v (-1g) earth?s surface x=1.65v(0g) y=2.31v (+1g) x=2.31v (+1g) y=1.65v (0g) x=0.99v (-1g) y=1.65v (0g) x=1.65v (0g) y=1.65v (0g) obsolete product(s) - obsolete product(s)
typical performance characteristics LIS2L02AL 12/17 5 typical performance characteristics 5.1 mechanical characteristics at 25c figure 5. x-axis zero-g level at 3.3v figure 6. y-axis zero-g level at 3.3v figure 7. x-axis sensitivity at 3.3v figure 8. y-axis sensitivity at 3.3v 1.55 1.6 1.65 1.7 1.75 0 5 10 15 20 25 zero?g level (v) percent of parts (%) 1.55 1.6 1.65 1.7 1.75 0 5 10 15 20 25 zero?g level (v) percent of parts (%) 0.62 0.63 0.64 0.65 0.66 0.67 0.68 0.69 0.7 0 5 10 15 20 25 sensitivity (v/g) percent of parts (%) 0.62 0.63 0.64 0.65 0.66 0.67 0.68 0.69 0.7 0 5 10 15 20 25 sensitivity (v/g) percent of parts (%) obsolete product(s) - obsolete product(s)
LIS2L02AL typical performance characteristics 13/17 5.2 mechanical characteristics de rived from measurement in the -40c to +85c temperature range figure 9. x-axis zero-g level change vs temperature figure 10. y-axis zero-g level change vs temperature figure 11. x-axis sensitivity change vs temperature figure 12. y-axis sensitivity change vs temperature ?0.4 ?0.2 0 0.2 0.4 0.6 0 5 10 15 20 25 30 35 zero?g level change (mg/deg. c) percent of parts (%) ?0.4 ?0.2 0 0.2 0.4 0.6 0 5 10 15 20 25 30 0?g level change (mg/deg. c) percent of parts (%) ?0.05 ?0.04 ?0.03 ?0.02 ?0.01 0 0.01 0.02 0.03 0 5 10 15 20 25 30 sensitivity change(%/deg. c) percent of parts (%) ?0.05 ?0.04 ?0.03 ?0.02 ?0.01 0 0.01 0.02 0.03 0 5 10 15 20 25 30 35 40 sensitivity change (%/deg. c) percent of parts (%) obsolete product(s) - obsolete product(s)
typical performance characteristics LIS2L02AL 14/17 5.3 electrical characteristics at 25c figure 13. noise density at 3.3v (x,y axis) figure 14. current consumption at 3.3v 18 20 22 24 26 28 30 32 0 5 10 15 20 25 30 35 noise density (ug/sqrt(hz)) percent of parts (%) 0.4 0.6 0.8 1 1.2 1.4 0 2 4 6 8 10 12 14 16 18 20 current consumption (ma) percent of parts (%) obsolete product(s) - obsolete product(s)
LIS2L02AL package information 15/17 6 package information in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. figure 15. lga-8 mechanical data & package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a1 1.460 1.520 1.600 0.0574 0.0598 0.0629 a2 1.330 0.0523 a3 0.180 0.220 0.260 0.007 0.0086 0.0102 d1 4.850 5.000 5.150 0.190 0.1968 0.2027 e1 4.850 5.000 5.150 0.190 0.1968 0.2027 l 1.270 0.05 l1 2.540 0.1 m 1.225 0.0482 m1 0.875 0.900 0.925 0.0344 0.0354 0.0364 n 2.000 0.0787 n1 1.225 0.0482 n2 1.170 0.046 p1 1.300 1.350 1.400 0.0511 0.0531 0.0551 p2 0.740 0.790 0.840 0.0291 0.0311 0.033 t1 1.170 0.046 t2 0.615 0.640 0.665 0.0242 0.0251 0.0261 r 1.200 1.600 0.0472 0.0629 h 0.150 0.0059 k 0.050 0.0019 j 0.100 0.0039 lga8 (5x5x1.6mm) land grid array package 7669231 c p2 p1 d1 k d detail a e e1 (4x) d k e k detail a d e 4 3 2 1 a1 a2 a3 r seating plane 5 6 7 8 l1 t2 l = = m1 t1 m n1 n2 n ha c b h a c b j a c b j a c b solder mask opening metal pad b a k k c obsolete product(s) - obsolete product(s)
revision history LIS2L02AL 16/17 7 revision history table 6. document revision history date revision changes 26-sep-2005 1 initial release. 03-may-2006 2 corrected typo errors. applied new corporate template layout. obsolete product(s) - obsolete product(s)
LIS2L02AL 17/17 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorize representative of st, st products are not designed, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems, where failure or malfunction may result in personal injury, death, or severe property or environmental damage. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com obsolete product(s) - obsolete product(s)

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